Allyl-derived precursor and synthesis method

Details Allyl-derived precursor and synthesis method Allyl-derived precursor and synthesis method

1999-03-30

2000-01-18

Nazario-Gonzalez, Porfirio

Organic compounds -- part of the class 532-570 series

Organic compounds

Heavy metal containing

556136, 427587, 4272481, C07F 108, C07F 110

Patent

active

060159189

ABSTRACT:
A Cu(hfac) allyl-derived ligand precursor has been provided. The ligand includes group consisting of alkyl, phenyl, trialkylsilane, trialkoxylsilane, halodialkylsilane, dihaloalkylsilane, trihalosilane, triphenylsilane, alkoxyl, halogen, chloroformate, cynanide, cycloalkyl, cycloalkylamine, alkyl ether, isocyanate, and pentafluorobenzene. Examples of the allyl-derived ligand precursors have proved to be stable at room temperatures, and sufficiently volatile at higher temperatures. Copper deposited with this precursor has low resistivity and high adhesive characteristics. A synthesis method has been provided which produces a high yield of the above-described precursors, including a Cu(hfac)(allyltrimethylsilane) precursor.

REFERENCES:
patent: 4385005 (1983-05-01), Doyle
patent: 4425281 (1984-01-01), Doyle
patent: 5085731 (1992-02-01), Norman et al.
patent: 5096737 (1992-03-01), Baum et al.
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Article entitled, "Chemical Vapor Deposition of Copper from Copper (I) Trimethylphosphine Compounds" by M.J. Hampden-Smith, T.T. Kodas, M. Paffett, J.D. Farr, and H.-K. Shin, Chem. Mater, 1990, 2, 636-639.
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Article entitled, "Chemical Vapor Deposition of Copper Thin Films with (hexafluoroacetylacetonate)Cu(allyltrimethylsilane", by Man-Young Park, Jong-Hoon Son, and Shi-Woo Rhee, Electrochemical and Solid-State Letters, 1 (1), 32-33, (1998).
Abstract entitled, "MOCVD of Copper from the Solution of New and Liquid Precursor (hfac)Cu(1-pentene)", by H.-K. Shin, Y.-H. Cho, D.-J. Yoo, H.-J. Shin, and E.-S. Lee, Materials Research Soc. Symp. Proc., vol. 514, 301.
Article entitled, "Hexafluoroacetylacetonate Cu Vinylcyclohexane as a Liquid Precursor for Low Temperature Chemical Vapor Deposition of Copper Thin Films", by Sang-Woo Kang, Man-Young Park, and Shi-Whoo Rhee, Electrochemical and Solid-State Letters, 2 (1), 22-23. (1999).
Shin et al., Chemical Abstracts, vol. 126, No. 7, abstract No. 97083k, p. 1296, Feb. 17, 1997.

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