Alloys for high temperature applications

Metal treatment – Compositions – Heat treating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148415, C22F 104

Patent

active

050873016

ABSTRACT:
This invention relates to a metal alloy, comprised of two elements, a solute and a solvent, the solute having a maximum equilibrium solid solubility (at one atmosphere pressure) of less than 1 wt. -% in the solvent, the solvent and the solute dissolved therein forming a matrix phase, the matrix phase having a subgrain structure defined by subgrain boundaries and particles at intersections of the boundaries, the subgrains having an average size of less than 5 microns in diameter, and, within the subgrains a dispersion of particles which are finer than the particles at the subgrain boundaries, both types of particles being harder than the matrix phase.

REFERENCES:
patent: 2966735 (1961-01-01), Towner et al.
patent: 2966736 (1961-01-01), Towner et al.
patent: 3172196 (1965-03-01), Beaver et al.
patent: 4347076 (1982-08-01), Ray et al.
patent: 4464199 (1984-08-01), Hildeman et al.
Savage et al., "Microstructural Characterization of As-Cast Rapidly Solidified Al-Sm, Al-Gd and Al-Er Binary Alloys", Proceedings of an International Conference, S.D. Ca., Feb. 3-5, 1986.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Alloys for high temperature applications does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Alloys for high temperature applications, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alloys for high temperature applications will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-779883

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.