Semiconductor device manufacturing: process – Making device array and selectively interconnecting
Reexamination Certificate
2008-01-15
2008-01-15
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Making device array and selectively interconnecting
C438S662000, C257SE21122, C257SE21591
Reexamination Certificate
active
07319052
ABSTRACT:
An alloying method includes the steps of forming a metal layer on a semiconductor having been transferred to a material having a low thermal conductivity, and alloying an interface between the semiconductor and the metal layer by irradiating the interface with a laser beam having a wavelength absorbable in at least one of the semiconductor and the metal layer. The irradiation energy of the laser beam is set in a range of 20 to 100 mJ/cm2. The material having a low thermal conductivity is a resin or amorphous silicon. According to the alloying method using laser irradiation, since the entire semiconductor is not heated and only a necessary portion is locally heated, the necessary portion can be readily alloyed to be converted into an ohmic contact without exerting adverse effect on characteristics of the semiconductor device. In the case of previously transferring a semiconductor to a material having a low thermal conductivity, for example, into a resin, and irradiating an interface between the semiconductor and an electrode with a laser beam, the interface between the semiconductor and the electrode can be alloyed at a low temperature, to lower the irradiation energy of the laser beam.
REFERENCES:
patent: 4359486 (1982-11-01), Patalong et al.
patent: 4526624 (1985-07-01), Tombrello et al.
patent: 5438241 (1995-08-01), Zavracky et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 5989944 (1999-11-01), Yoon
patent: 6030849 (2000-02-01), Hasegawa et al.
patent: 6110813 (2000-08-01), Ota et al.
patent: 6111277 (2000-08-01), Ikeda
patent: 6204079 (2001-03-01), Aspar et al.
patent: 6252261 (2001-06-01), Usui et al.
patent: 6274889 (2001-08-01), Ota et al.
patent: 6277711 (2001-08-01), Wu
patent: 6316357 (2001-11-01), Lin et al.
patent: 6403451 (2002-06-01), Linthicum et al.
patent: 6576571 (2003-06-01), Biwa et al.
patent: 6583445 (2003-06-01), Reedy et al.
patent: 6586778 (2003-07-01), Gehrke et al.
patent: 6610144 (2003-08-01), Mishra et al.
patent: 6613610 (2003-09-01), Iwafuchi et al.
patent: RE38466 (2004-03-01), Inoue et al.
patent: 56-064480 (1981-01-01), None
patent: 57-72322 (1982-05-01), None
patent: 61-231730 (1986-10-01), None
patent: 61-231737 (1986-10-01), None
Ohata Toyoharu
Tomoda Katsuhiro
Depke Robert J.
Isaac Stanetta
Lebentritt Michael
Rockey, Depke & Lyons LLC.
Sony Corporation
LandOfFree
Alloying method, and wiring forming method, display device... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Alloying method, and wiring forming method, display device..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alloying method, and wiring forming method, display device... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2792675