Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2005-01-11
2005-01-11
Zarabian, Amir (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C337S159000
Reexamination Certificate
active
06841845
ABSTRACT:
An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In-Sn alloy is used, the operation stability to a heat cycle can be satisfactorily assured, and, even when the amount of In is large, a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C. The fuse element has an alloy composition in which 0.1 to 7 weight parts of one, or two or more metals selected from the group consisting of Ag, Au, Cu, Ni, Pd, Pt, and Sb are added to 100 weight parts of an alloy of 52 to 85% In and a balance Sn.
REFERENCES:
patent: 5982268 (1999-11-01), Kawanishi
patent: 2002-25402 (2002-01-01), None
patent: 2002025404 (2002-01-01), None
Ikawa Naotaka
Iwamoto Miki
Saruwatari Toshiaki
Tanaka Yoshiaki
Akin Gump Strauss Hauer & Feld & LLP
Rose Kiesha
Uchihashi Estec Co., Ltd.
Zarabian Amir
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