Alloy solder connect assembly and method of connection

Details Alloy solder connect assembly and method of connection Alloy solder connect assembly and method of connection

1994-09-29

1996-09-03

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228245, 228 563, 228193, 437183, 427123, H05K 334, H01L 2158

Patent

active

055516270

ABSTRACT:
An electronic assembly (100) includes multiple solder connections (101) coupling faying surfaces (202, 204) of two substrates (106, 108). A solder connection (201) is fabricated by reflow heating of a first, less compliant solder paste (312, 314) and a compliant preform (210) so as to cause compliant material of the preform (210) to dissolve into the solder paste (312, 314). Upon solidification of the solder paste (312, 314), blended regions (520, 522), having a gradual, changing concentration of compliant material form between resulting fillets (212, 214) and the preform (210). The blended regions (520, 522) transfer temperature induced shear stresses, caused by thermal cycling of the electronic assembly (100), from the fillets (212, 214) into the compliant preform (210).

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Transactions of the Metallurgical Society of AIME, "Applications of Solid-Liquid Interdiffusion (SLID) Bonding in Integrated Circuit Fabrication", L. Bernstein and H. Bartholomew, vol. 236, Mar. 1966, pp. 405-412.
Howard H. Manko, "Solders and Soldering," 1979 by McGraw-Hill, pp. 110, 132-133.

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