Alloy powder, dispersion-type conductor using the same

Details Alloy powder, dispersion-type conductor using the same Alloy powder, dispersion-type conductor using the same

1993-06-24

1995-10-17

Wyszomierski, George

Metal treatment

Stock

Copper base

75247, 252514, 420497, C22C 900

Patent

active

054587026

ABSTRACT:
Alloy powder which is low in price and is unlikely to be oxidized on the surface, and a dispersion-type conductor using the alloy powder in which electromigration is not likely to occur. Melt of copper and silver is cooled at a high cooling speed of 10.sup.5 .degree. C./s or higher. Alloy powder having a composition expressed by a chemical formula Cu.sub.x Ag.sub.1-x (where 0.80.ltoreq.X.ltoreq.0.99) is obtained. Also, a dispersion-type conductor is produced by dispersing 100 parts by weight of the alloy powder in between 5-100 parts by weight of a binder. Thus, the low-priced alloy powder and the dispersion-type conductor of high quality and high reliability can be obtained.

REFERENCES:
patent: 4891068 (1990-01-01), Masumoto et al.
patent: 5091114 (1992-02-01), Nakajima et al.
patent: 5198154 (1993-03-01), Yokoyama et al.
patent: 5242511 (1993-09-01), Yokoyama et al.
Hansen, M., Constitution of Binary Alloys, pp. 18-19, McGraw-Hill, 1958.

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