Alloy for soldering aluminum

Specialized metallurgical processes – compositions for use therei – Processes – Free metal or alloy reductant contains magnesium

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75134B, 75134D, 75166D, C22C 1100

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041734688

ABSTRACT:
An improved alloy especially suitable for soldering aluminum to aluminum or aluminum to other metals which has a base containing bismuth, lead and/or cadmium to which is added the following in small amounts: silver, antimony, cobalt, copper, manganese and nickel. The resulting alloy has a melting and flowing temperature below 550.degree. F. and exhibits improved resistance to interface corrosion by virtue of an intermetallic compound layer formed at the interface.

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patent: 2486202 (1949-10-01), Phipps
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patent: 2685893 (1954-08-01), Phipps
patent: 2993785 (1961-07-01), Borchers et al.
patent: 3716909 (1973-02-01), Stokes et al.
patent: 3769007 (1973-10-01), Stokes et al.
Lead and Lead Alloys, Ed. W. Hofmann, Springer, N.Y. 1970, pp. 129-132.

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