All metal flat package having excellent heat transfer characteri

Details All metal flat package having excellent heat transfer characteri All metal flat package having excellent heat transfer characteri

1978-09-14

1981-05-05

Kozma, Thomas J.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 357 74, H05K 504

Patent

active

042660890

ABSTRACT:
An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.

REFERENCES:
patent: 2880383 (1959-03-01), Taylor
patent: 3190952 (1965-06-01), Bitko
patent: 3548076 (1970-12-01), Cooke et al.
patent: 3733691 (1973-05-01), Mann
patent: 3988825 (1976-11-01), Fuchs et al.
patent: 4063348 (1977-12-01), Borden et al.

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