All metal flat package for microcircuitry

Details All metal flat package for microcircuitry All metal flat package for microcircuitry

1985-08-12

1987-03-10

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 357 74, H05K 504

Patent

active

046492291

ABSTRACT:
A flat package for electric microcircuits has an iron-nickel-cobalt alloy frame which is brazed to a molybdenum bottom at a temperature below about 400.degree. C. The molybdenum bottom has successive layers of copper, nickel and gold plating.

REFERENCES:
patent: 3219748 (1965-11-01), Miller
patent: 3514849 (1970-06-01), Landron, Jr.
patent: 3602634 (1971-08-01), Meuli
patent: 4266090 (1981-05-01), Scherer

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