Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2000-09-11
2001-07-03
Gupta, Yogendra N. (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S372000, C510S375000, C134S002000
Reexamination Certificate
active
06255266
ABSTRACT:
BACKGROUND OF THE INVENTION
(1) Field of the Invention
The invention relates to a method of cleaning equipment surfaces in the fabrication of integrated circuits, and more particularly, to a method of cleaning copper, cobalt, or nickel from equipment surfaces in the manufacture of integrated circuits.
(2) Description of the Prior Art
Management of copper contamination is an important aspect of future high-tech wafer fabs. The current procedure of cleaning broken wafers that incorporate copper films (100% copper) in multi-level interconnects is to wipe the effected equipment parts with isopropyl alcohol (IPA) and/or use a vacuum hose to suck out broken pieces. However, IPA does not dissolve copper, so copper remnants will still exist in the equipment. Furthermore, copper pieces on wipes, gloves, and cleanroom suits may accidentally contaminate wafer processing. The aforementioned contamination is also applicable to cobalt and nickel.
U.S. Pat. No. 4,714,517 to Malladi et al teaches copper cleaning using a mild organic acid solution. TMAH cleaning is also mentioned. U.S. Pat. No. 5,882,433 to Ueno discloses a spin-cleaning method using IPA. U.S. Pat. No. 5,650,356 to Grivna et al teaches a hydrogen peroxide solution to prevent corrosion on metal surfaces. U.S. Pat. No. 4,814,408 to Itoh et al discloses a self-adhering silicone composition including alkyldione peroxides.
SUMMARY OF THE INVENTION
A principal object of the present invention is to provide an effective and very manufacturable method of cleaning metals from equipment surfaces in the fabrication of integrated circuits.
Another object of the invention is to provide a method of cleaning metals from equipment surfaces without corroding or destroying the parts and surfaces of the equipment.
Another object of the invention is to provide a method of cleaning elemental copper from the surface of equipment hardware in the event of wafer breakage without corroding or destroying the parts and surfaces of the equipment.
Yet another object of the invention is to provide a method of cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage without corroding or destroying the parts and surfaces of the equipment.
Yet another object of the invention is to provide a method of cleaning elemental copper from the surface of equipment hardware in the event of wafer breakage using a novel alkyldione peroxide solution without corroding or destroying the parts and surfaces of the equipment.
A further object of the invention is to provide a method of cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage using a novel alkyldione peroxide solution without corroding or destroying the parts and surfaces of the equipment.
A further object is to provide a novel alkyldione peroxide solution for cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage without corroding or destroying the parts and surfaces of the equipment.
A still further object is to provide a novel alkyldione peroxide solution for cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in non-wafer breakage events.
In accordance with the objects of this invention a method of cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage is achieved. A solution comprising an alkyldione peroxide is used to oxidize the metal and form soluble complexes which are removed by the cleaning solution.
Also in accordance with the objects of the invention, a novel alkyldione peroxide solution for cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage is provided without corroding or destroying the parts and surfaces of the equipment.
REFERENCES:
patent: 4714517 (1987-12-01), Malladi et al.
patent: 4814408 (1989-03-01), Itoh et al.
patent: 5650356 (1997-07-01), Grivna et al.
patent: 5882433 (1999-03-01), Ueno
patent: 6106853 (2000-08-01), Cox et al.
patent: 6132521 (2000-10-01), Gupta et al.
Gupta Subhash
Ho Paul
I Simon Choo
Zhou Mei Sheng
Chartered Semiconductor Manufacturing Ltd.
Gupta Yogendra N.
Petruncio John M
Pike Rosemary L. S.
Saile George O.
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