Alkanolamine semiconductor process residue removal composition a

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

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510405, 510407, 510488, 510499, 510505, C11D 330, C11D 333, C11D 732, C11D 750

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active

061212172

ABSTRACT:
A two carbon atom linkage alkanolamine compound composition comprises the two carbon atom linkage alkanolamine compound, gallic acid or catechol, and optionally, an aqueous hydroxylamine solution. The balance of the composition is made up of water, preferably high purity deionized water, or another suitable polar solvent. A process for removing photoresist or other residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, comprises contacting the substrate with the composition for a time and at a temperature sufficient to remove the photoresist or other residue from the substrate. Use of the two carbon atom linkage alkanolamine compound in the composition and process provides superior residue removal without attacking titanium or other metallurgy, oxide or nitride layers on the substrate.

REFERENCES:
patent: 4111767 (1978-09-01), Kawagishi et al.
patent: 4395348 (1983-07-01), Lee
patent: 4617251 (1986-10-01), Sizensky
patent: 4626411 (1986-12-01), Nemes et al.
patent: 4824763 (1989-04-01), Lee
patent: 4941941 (1990-07-01), Austin et al.
patent: 5279771 (1994-01-01), Lee
patent: 5334332 (1994-08-01), Lee
patent: 5381807 (1995-01-01), Lee
patent: 5399464 (1995-03-01), Lee
patent: 5417877 (1995-05-01), Ward
patent: 5419779 (1995-05-01), Ward
patent: 5482566 (1996-01-01), Lee
patent: 5496491 (1996-03-01), Ward et al.
patent: 5554312 (1996-09-01), Ward
patent: 5556482 (1996-09-01), Ward et al.
patent: 5563119 (1996-10-01), Ward

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