Alkaline plating baths and electroplating process

Details Alkaline plating baths and electroplating process Alkaline plating baths and electroplating process

1982-09-28

1983-06-21

Edmundson, F.

Chemistry: electrical and wave energy

Processes and products

204 43S, 204 53, 204 54R, 204DIG2, C25D 332, C25D 336, C25D 358

Patent

active

043892868

ABSTRACT:
Cyanide-free plating baths for the electrodeposition of copper alloys comprise aqueous alkaline mixtures which contain copper and either lead or tin ions and a chelating agent selected from glucoheptonic acid and its salts. Processes for electroplating using the bath and for removing the metal ions from the spent baths by pH adjustment are also disclosed.

REFERENCES:
patent: 2700646 (1955-01-01), Chester
patent: 3111465 (1963-11-01), Passal
patent: 3219560 (1963-12-01), Leenders et al.
patent: 3616291 (1971-10-01), Wilson
patent: 3642591 (1972-02-01), Boose et al.
Ratajczak, L'Industrie Chimique, vol. 56, pp. 35, 36, (Feb. 1969).

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