Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...
Patent
1981-06-12
1982-10-12
Wong, Jr., Harry
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Polymers from only ethylenic monomers or processes of...
C08F 2606
Patent
active
043540120
ABSTRACT:
A moisture resistant polyimide adhesive is disclosed comprising a polymer having repeating units of the formula: ##STR1## where n is equal to about 8 to about 20. The improved moisture resistance of the polymers according to the present invention is indicated by a moisture pick-up of less than about 0.6% by weight after 24 hour immersion in room temperature water. The polymer also exhibits a tensile strength greater than about 1800 psi (1.24.times.10.sup.7 NT/M.sup.2). In addition to their improved adhesive and moisture resistant properties, the polymers according to the present invention exhibited such properties with cure times of less than about one hour at temperatures up to about 320.degree. C.
REFERENCES:
patent: 3380964 (1968-04-01), Grundschober et al.
patent: 3406148 (1968-10-01), Sambeth et al.
patent: 3450711 (1969-06-01), Megna et al.
patent: 3678073 (1972-07-01), Borden et al.
patent: 3717615 (1973-02-01), Halub et al.
patent: 3759779 (1973-09-01), Dumas
patent: 3761430 (1973-09-01), Witzel
patent: 3959234 (1976-05-01), Kurosawa et al.
patent: 4011386 (1977-03-01), Matsumoto et al.
patent: 4043986 (1977-08-01), Gruffaz et al.
Stille, J. K. et al., "Polymerization by the Diels-Alder Reaction",J. Org. Chem: vol. 26, pp. 4026-4029, 1961.
Furdik, M. et al., Chem. Avesti, vol. 17(1), pp. 31-40, 1963.
Serafini, T. T. et al., "Thermally Stable Polyimides from Solutions of Monomer Reactants", J. Applied Polymer Science, vol. 16, pp. 905-915, 1972.
Serafini, T. T. et al., "A Review of Processable High Temperature Resistant Addition-Type Laminating Resins", Applied Polymer Symposium No. 22, pp. 89-100, 1973.
St. Clair, A. K. et al., "Structure-Property Relationships of Isomeric _Addition Polyimides Containing Nadimide End Groups, Polymer Engineering and Science," vol. 16, No. 5, pp. 314-317, May 1976.
Gwinnell Harry J.
United Technologies Corporation
Wong, Jr. Harry
LandOfFree
Aliphatic diene bis-imide polymers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Aliphatic diene bis-imide polymers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aliphatic diene bis-imide polymers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-224044