Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1991-09-24
1993-06-08
Heitbrink, Jill L.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156229, 156230, 156361, 156362, 156541, B32B 3100
Patent
active
052175502
ABSTRACT:
Prior to the press-contact between a pattern-transferring flat plate and a transfer-receiving flat plate, at least one of these flat plates is moved to a predetermined position to effect the positioning therebetween, while the positional relation between the pattern-transferring flat plate and the transfer-receiving flat plate is optically observed, and thereafter these flat plates are sequentially press-contacted to each other from an end of the flat plates. Therefore, there is no positional difference between the flat plates which have been correctly positioned, and further the adhesion strength between the transfer pattern and the transfer-receiving flat plate is uniform.
REFERENCES:
patent: 4452659 (1984-06-01), Guertsen et al.
patent: 4539063 (1985-09-01), Cue et al.
patent: 4859269 (1989-08-01), Nishiguchi
patent: 4902371 (1990-02-01), Andris et al.
patent: 5047110 (1991-09-01), Bryant et al.
patent: 5073223 (1991-12-01), Kurihara
Asaka Kenji
Takeuchi Satoshi
Dai Nippon Printing Co. Ltd
Heitbrink Jill L.
LandOfFree
Alignment transfer method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Alignment transfer method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alignment transfer method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1931179