Alignment system

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

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Details

2504922, A61K 2702, H01L 700

Patent

active

043854346

ABSTRACT:
An alignment system for realigning one portion of an integrated circuit wafer relative to another portion of the same wafer including: a support member for mounting a wafer to be realigned and having a plurality of laterally disposed zones; and means for selectively, laterally deforming the zones of the support member for realigning corresponding portions of a wafer mounted on the support member.

REFERENCES:
patent: 3875416 (1975-04-01), Spicer
patent: 4322626 (1982-03-01), Kawashima

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