Alignment structure and method for mating a wafer delivery...

Details Alignment structure and method for mating a wafer delivery... Alignment structure and method for mating a wafer delivery...

2005-07-05

2005-07-05

Lee, John R. (Department: 2881)

Radiant energy

Means to align or position an object relative to a source or...

C414S217000, C414S416060, C414S937000, C414S940000

Reexamination Certificate

active

06914251

ABSTRACT:
Apparatus and method for placement of workpieces such as silicon wafers in relation to an integrated circuit fabrication tool. A robotic arm mounted in relation to the tool moves workpieces in and out of the tool. A spacer has an exposed spacer surface facing away from the tool. The relative position of this exposed spacer surface is adjustable with respect to the tool. A movable cassette support supports one or more workpieces and is placed in abutting relationship with the spacer surface. It is onto this cassette support surface that a conveyor system such as an overhead transport delivers cassettes containing workpieces such as wafers for subsequent treatment by the tool.

REFERENCES:
patent: 4449885 (1984-05-01), Hertel et al.
patent: 5828070 (1998-10-01), Brailove et al.
patent: 6053688 (2000-04-01), Cheng

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