Alignment precision enhancement of electronic component...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S825000, C029S832000, C029S834000, C029S835000

Reexamination Certificate

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07444733

ABSTRACT:
Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.

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