Alignment method of two substrates by microcoils

Details Alignment method of two substrates by microcoils Alignment method of two substrates by microcoils

2011-03-08

2011-03-08

Nguyen, Hoai-An D (Department: 2858)

Electricity: measuring and testing

Impedance, admittance or other quantities representative of...

Lumped type parameters

C324S245000, C702S150000

Reexamination Certificate

active

07902837

ABSTRACT:
Substrates to be aligned include microcoils arranged at the level of their facing surfaces. In an alignment phase, power is supplied to at least the microcoils of the first substrate, whereas the inductance of the microcoils of the second substrate is measured. The microcoils are preferably flat microcoils in the form of a spiral or a serpentine.

REFERENCES:
patent: 4371116 (1983-02-01), Sage et al.
patent: 6911664 (2005-06-01), Il'ichev et al.
patent: 7027160 (2006-04-01), Sperling
patent: 7084534 (2006-08-01), Ohishi
patent: 7193423 (2007-03-01), Dalton et al.
patent: 2002/0110936 (2002-08-01), Wada et al.
patent: 2004/0033025 (2004-02-01), Richard et al.
patent: 2007/0178612 (2007-08-01), Bradl et al.
patent: 10 2006 001 601 (2007-07-01), None
patent: 0 439 136 (1991-07-01), None

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