Alignment method of a laser beam processing machine

Radiant energy – Means to align or position an object relative to a source or...

Reexamination Certificate

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Details

C250S492100, C219S121600, C219S121750, C438S462000, C438S463000

Reexamination Certificate

active

07569840

ABSTRACT:
An alignment method of a laser beam processing machine comprising a chuck table, a laser beam application means having a condenser for applying a laser beam to the workpiece held on the chuck table, an image pick-up means for picking up an image of the workpiece held on the chuck table and a control means having a memory for storing the specifications of the workpiece, the method comprising the steps of storing the design coordinates of a processing position set based on the mark indicating the crystal orientation of a wafer and alignment marks; picking up an image of the periphery of the wafer with the image pick-up means and locating the mark indicating the crystal orientation of the wafer at a predetermined position; positioning the design coordinate position of each of the alignment marks set based on the mark indicating the crystal orientation of the wafer right below the condenser and applying a laser beam from the condenser so as to remove the insulating film in the alignment mark areas; and picking up an image of the alignment marks with the image pick-up means and adjusting the coordinates of the processing position of the wafer on the chuck table based on the image of the alignment marks.

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patent: 2003-163323 (2003-06-01), None
patent: 2007-67082 (2007-03-01), None

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