Alignment method in a wafer prober

Details Alignment method in a wafer prober Alignment method in a wafer prober

1988-09-02

1990-06-19

Haroian, Harry N.

Geometrical instruments

Gauge

Collocating

33613, 33 1M, 324158F, G01B 700

Patent

active

049340646

ABSTRACT:
A wafer prober for contacting probe needles of a probe card to bonding pads of a chip formed on a wafer, for allowing examination of characteristics of the chip, is disclosed. The wafer prober includes a wafer holder for holding a wafer and moving the same in X and Y directions. By the wafer holder, the wafer can be moved from an alignment information detecting station whereat alignment information can be detected by use of a TV camera, to an examining station whereat the probe needles of the probe card are used for the examination. The position of the wafer in a Z direction at the time when the alignment information is detected by the TV camera, can be made substantially coincident with the position of the wafer in the Z direction at the time when the probe needles contact the bonding pads. By this, an error caused by the movement of the wafer holder in the Z direction does not affect against the alignment accuracy of the wafer in the X and Y directions, such that the probe needles can correctly contact the bonding pads.

REFERENCES:
patent: 4052793 (1977-10-01), Coughlin
patent: 4786867 (1988-11-01), Yamatsu

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