Alignment method for fabrication of integrated ultrasonic...

Details Alignment method for fabrication of integrated ultrasonic... Alignment method for fabrication of integrated ultrasonic...

2006-05-30

2006-05-30

Vu, David (Department: 2818)

Surgery

Diagnostic testing

Detecting nuclear, electromagnetic, or ultrasonic radiation

C029S025350

Reexamination Certificate

active

07052464

ABSTRACT:
An integrated circuit is fabricated by micromachining a hexagonal array of cMUT elements on top of a substrate comprising a hexagonal array of CMOS cells. Each cMUT element overlies a respective CMOS cell in one-to-one correspondence. During layout of the mask for micromachining the cMUT layer, either the hexagonal pattern or the alignment key is rotated until an axis of symmetry of the hexagonal pattern is aligned with an axis of the alignment key. Later, when the mask is superimposed on the CMOS substrate, the alignment key on the mask is aligned with an alignment key on the substrate. This ensures that the cMUT elements formed by optical lithography will be matched to the CMOS cells.

REFERENCES:
patent: 6384516 (2002-05-01), Fraser
patent: 6571445 (2003-06-01), Ladabaum
patent: 6632178 (2003-10-01), Fraser
patent: 6659954 (2003-12-01), Robinson

Affiliated with

Also associated with

Rating

Alignment method for fabrication of integrated ultrasonic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Alignment method for fabrication of integrated ultrasonic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alignment method for fabrication of integrated ultrasonic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3611941