Alignment method and semiconductor exposure method

Radiation imagery chemistry: process – composition – or product th – Registration or layout process other than color proofing

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G03F 900

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056958978

ABSTRACT:
An alignment method or an exposure method in an exposure process in which a first stepper having a first reduction magnification and a second stepper having a second reduction magnification, higher than the first reduction magnification, are used in combination. For a global alignment through the first stepper on the basis of alignment marks having been defined through the second stepper in relation to shots thereof, in every shot of the first stepper the position of such alignment mark or marks to be measured is made variable with respect to the shot center.

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Patent Abstract of Japan, vol. 18, No. 545, published Jul. 15, 1994; English Abstract of Japanese Patent No. 6-196384.

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