Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Reexamination Certificate
2006-08-29
2006-08-29
Smoot, Stephen W. (Department: 2813)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Optical characteristic sensed
C250S492220, C430S030000
Reexamination Certificate
active
07098046
ABSTRACT:
A method for aligning existing layers formed prior to a new layer and the new layer in forming the new layer on a wafer4, wherein a microscope6as a first measurement condition and a microscope7as a second measurement condition are used, and marks4aand4bformed in each of said existing layers are measured by switching the first and second conditions, and said existing layers and said new-layer are aligned based on measurement of mark position of each of said existing layers, and the microscope7has a plurality of measurement conditions as optical characteristics, and the measurement conditions are switched.
REFERENCES:
patent: 4769680 (1988-09-01), Resor, III et al.
patent: 5361122 (1994-11-01), Kataoka et al.
patent: 5403754 (1995-04-01), Jackson
patent: 5532091 (1996-07-01), Mizutani
patent: 5751428 (1998-05-01), Kataoka et al.
patent: 5783341 (1998-07-01), Uzawa
patent: 5835196 (1998-11-01), Jackson
patent: 5945239 (1999-08-01), Taniguchi
patent: 5998226 (1999-12-01), Chan
patent: 6416912 (2002-07-01), Kobayashi et al.
patent: 6473156 (2002-10-01), Kataoka
patent: 6590637 (2003-07-01), Nishi
patent: 6838686 (2005-01-01), Kataoka
patent: 6876435 (2005-04-01), Kataoka et al.
patent: 2002/0014601 (2002-02-01), Yoshida
patent: 7-321012 (1995-12-01), None
Fitzpatrick ,Cella, Harper & Scinto
Smoot Stephen W.
LandOfFree
Alignment method and exposure apparatus using the method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Alignment method and exposure apparatus using the method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alignment method and exposure apparatus using the method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3646094