Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Patent
1997-02-21
1999-04-20
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
228 491, 22818022, 228185, 29740, 29834, 361777, H01R 909, H05K 334, B32B 3106
Patent
active
058955542
ABSTRACT:
A method and apparatus for aligning an electronic component with a base member where a pattern of contacts on the component are to be bonded to an identical pattern of contacts on the base member. Templates having indentations along one edge shaped to align with the contact pattern on the component and base member can be positioned in alignment with the base member contact pattern along two sides of the pattern and releasably secured in place, such as by tape. The component is placed over the base member with its contacts aligned with the template. This assures precise alignment of the two contact patterns. The assembly can be heated to the melting point of the solder and cooled to bond all of the contacts together. The templates are removed for reuse. With ball grid array components, the template indentations are preferably partially-circular to align with the edge row of round solder contact pads. With linear arrays of short elongated solder pads, preferably the template has plural spaced fingers configured to fit between the solder pads.
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Duncan John R.
Gilliam Frank D.
Purvis Sue
Simmons David A.
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