Alignment method and apparatus

Details Alignment method and apparatus Alignment method and apparatus

1990-06-28

1998-05-19

Pham, Hoa Q.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

250548, G01B 1100

Patent

active

057543003

ABSTRACT:
An error in alignment between both positions is obtained from reference position information incorporated in advance in an exposure apparatus for manufacturing a semiconductor and detection position information obtained by physically non-contact measuring a mark formed on an object to be measured such as a wafer, a mask or a wafer stage. This mark has a construction having a periodic pattern at a predetermined pitch in connection with a scanning direction. A periodic signal obtained by non-contact scanning the mark is subjected to Fourier integration processing and a phase angle including not only a fundamental wave component but a high-order component by calculation of a sine wave and a cosine component of Fourier conversion to thereby detect position information of an average center position of the mark with a correction of a mark deformation caused by wafer or process of mask added thereto. An error in alignment is corrected by relatively moving said object to a reference position.

REFERENCES:
patent: 4600390 (1986-07-01), Fay
patent: 4626907 (1986-12-01), Schedewie

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