Alignment method and apparatus

Details Alignment method and apparatus Alignment method and apparatus

1992-04-16

1995-04-11

Thomas, Tom

Fishing, trapping, and vermin destroying

437924, H01L 21312

Patent

active

054058104

ABSTRACT:
The present invention enables the accuracy of aligning a wafer and a reticle with each other in the exposure step in the manufacture of a semiconductor integrated circuit device to be improved. The portions of a metal film 5 and a resist film 6 which cover an alignment mark 4 on a wafer 1 are removed by a gas assisted etching treatment using a laser beam prior to the execution of an exposure treatment, so as to bare the alignment mark 4. The position detecting light is then applied from an alignment mark position detecting means in a reduction projection exposure unit 11 to the alignment mark 4, the position of the alignment mark 4 being detected on the basis of the light reflected on and scattered from the alignment mark 4.

REFERENCES:
patent: 4377028 (1983-03-01), Imahashi
patent: 4414749 (1983-11-01), Johannsmeier
patent: 4936930 (1990-06-01), Gruber et al.

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