Alignment method, alignment system, and product with...

Optics: measuring and testing – Position or displacement – Position transverse to viewing axis

Reexamination Certificate

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C356S401000, C430S005000, C430S311000

Reexamination Certificate

active

08072615

ABSTRACT:
The position of a product is measured using an alignment mark on the product. Radiation is transmitted towards the alignment mark and diffracted by a pattern in the alignment mark. Position information is determined from phase relations of the diffracted radiation. The alignment mark comprises a set of mutually parallel conductor tracks from which the diffracted radiation is collected, the pattern being defined by a pattern of variation of the pitch between successive tracks as a function of position along the surface of the product. Thus, for example the pattern comprises alternating first and second areas wherein the pitch has a first and second value, respectively. Because the tracks in the different parts of the pattern, such as the first and second areas, are parallel to each other improved measurements are possible.

REFERENCES:
patent: 5418613 (1995-05-01), Matsutani
patent: 5777392 (1998-07-01), Fujii
patent: 6521900 (2003-02-01), Hirayanagi
patent: 6844918 (2005-01-01), Koren et al.
patent: 7372565 (2008-05-01), Holden et al.
patent: 7800824 (2010-09-01), Wang et al.
patent: 7803502 (2010-09-01), Sato et al.
patent: 2005/0146699 (2005-07-01), Levasier et al.
patent: 2005/0184234 (2005-08-01), Nakayama
patent: 2005/0195398 (2005-09-01), Adel et al.
patent: 2006/0091330 (2006-05-01), Van Bilsen et al.
patent: 2007/0052113 (2007-03-01), Marokkey et al.
patent: 2007/0114678 (2007-05-01), Van Haren et al.
patent: 2008/0008941 (2008-01-01), Sato et al.
patent: 0 595 020 (1994-05-01), None
patent: 0 823 667 (1998-02-01), None
patent: 63-153818 (1988-06-01), None
patent: 07-225113 (1995-08-01), None
patent: 08-264423 (1996-10-01), None
patent: 10-270347 (1998-10-01), None
patent: 2000-252190 (2000-09-01), None
patent: 2004-279405 (2004-10-01), None
patent: 2004-282017 (2004-10-01), None
patent: 2008-003520 (2008-01-01), None
Megens et al., “Advances in Process Overlay—Alignment Solutions for Future Technology Nodes”, Metrology, Inspection, and Process Control for Microlithography XXI, Proceedings of SPIE, vol. 6518, Part 2 of 3, Feb. 2007, 13 pgs.
First Office Action mailed Feb. 12, 2010 for Chinese Application No. 200810185523.2, 3 pgs.
Search Report for Singapore Application No. 200808908-8 mailed Oct. 2, 2009, 4 pgs.
English language Abstract of Japanese Patent Publication No. 63-153818 A, published Jun. 27, 1988, the Japanese Patent Office; 1 page.
English language Abstract of Japanese Patent Publication No. 07-225113 A, published Aug. 22, 1995, the Japanese Patent Office; 1 page.
English language Abstract of Japanese Patent Publication No. 08-264423 A, published Oct. 11, 1996, the Japanese Patent Office; 1 page.
English language Abstract of Japanese Patent Publication No. 10-270347 A, published Oct. 9, 1998, the Japanese Patent Office; 1 page.
English language Abstract of Japanese Patent Publication No. 2000-252190 A, published Sep. 14, 2000, the Japanese Patent Office; 1 page.
English language Abstract of Japanese Patent Publication No. 2004-279405 A, published Oct. 7, 2004, the Japanese Patent Office; 1 page.
English language Abstract of Japanese Patent Publication No. 2004-282017 A, published Oct. 7, 2004, the Japanese Patent Office; 1 page.
English language Abstract of Japanese Patent Publication No. 2008-003520 A, published Jan. 10, 2008, the Japanese Patent Office; 1 page.
English translation of Japanese Notice of Reasons for Rejection, directed to related Japanese Application No. 2008-309352, mailed May 6, 2011; 3 pages.

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