Alignment method

Details Alignment method Alignment method

1987-10-02

1989-03-07

Wintercorn, Richard A.

Photocopying

Projection printing and copying cameras

Methods

355 43, 355 53, G03B 2732

Patent

active

048110590

ABSTRACT:
An improved alignment method usable in a step-and-repeat type alignment and exposure apparatus for photolighographically transferring images of a pattern of a reticle onto different shot areas on a semiconductor wafer, for manufacture of semiconductor devices. According to this method, the alignment is executed with respect to an X direction, a Y direction and a rotational direction parallel to a plane containing the X and Y directions. With regard to the rotational direction, positional deviation of the wafer as a whole with respect to the reticle is measured and corrected prior to the initiation of the step-and-repeat photoprinting. With regard to the X and Y directions, detection and correction of any deviation are executed for each of the shot areas of the wafer. By this, high-accuracy and high-speed alignment is attainable for all the shot areas of the wafer.

REFERENCES:
patent: 4452526 (1984-06-01), Johannsmeier et al.
patent: 4669866 (1987-06-01), Phillips
patent: 4669867 (1987-06-01), Uda et al.

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