Alignment method

Details Alignment method Alignment method

1988-11-16

1989-11-14

Griffin, Donald A.

Photocopying

Projection printing and copying cameras

Step and repeat

250548, G03B 2742, G01B 1100

Patent

active

048811009

ABSTRACT:
An alignment method usable in an apparatus for transferring images of a pattern of a mask onto different portions of a semiconductor wafer in a step-and-repeat manner, is disclosed. In this alignment method, positional deviation of at least one portion of the wafer with respect to the mask is measured and, on the basis of this measurement, the mask and the wafer are aligned with each other. After this,step-and-repeat exposure is executed. When the measurement of the positional deviation of the at least one portion of the wafer is unattainable, another portion of the wafer is selected and the deviation measurement is executed in respect to the selected portion. In another aspect of the invention, with regard to a rotational component of the deviation of the wafer, measurement and alignment are repeatedly executed until the rotational component becomes less than a predetermined value. Thereafter, the step-and-repeat exposure is initiated.

REFERENCES:
patent: 4345836 (1982-08-01), Phillips
patent: 4597664 (1986-07-01), Johannsmeier et al.
patent: 4613230 (1986-09-01), Iwai
patent: 4669867 (1987-06-01), Uda et al.
patent: 4712016 (1987-12-01), Matsumura
patent: 4719357 (1988-01-01), Ayata et al.

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