Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-04-29
1997-08-12
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174254, 174260, 257692, 257797, 361760, 361772, 361776, 439 68, H05K 111, H05K 114, H01L 23544
Patent
active
056572077
ABSTRACT:
A substrate has a plurality of circuit traces having ends which terminate in raised contacts and an integrated circuit (IC) chip has a plurality of circuit traces terminating in contact ends which engage the raised contacts when the IC chip is positioned onto the substrate. The substrate also has a plurality of raised features thereon which are higher than and spaced from the raised contacts. The raised features have tapered side surfaces for engaging vertically extending surfaces on the IC chip to guide the IC chip into place of the substrate and so that its contact ends are aligned with and engage the raised contacts.
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IBM Technical Disclosure Bulletin "Chip-to-Pin Carrier Interconnection System", vol. 21 No. 7, Dec. 1978 pp. 2707 and 2708.
Le Bao
Schreiber Chris M.
Brooks Cary W.
Packard Hughes Interconnect Company
Sparks Donald
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