Alignment marks on semiconductor wafers and method of manufactur

Details Alignment marks on semiconductor wafers and method of manufactur Alignment marks on semiconductor wafers and method of manufactur

1984-05-18

1989-04-25

Rosenberger, R. A.

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

G01B 1100

Patent

active

048242543

ABSTRACT:
Alignment marks on a semiconductor wafer comprise a first alignment island projecting from a surface of the wafer and a second alignment island having substantially the same height as the first alignment island and surrounding the same with a slit therebetween. The slit is utilized as a pattern for aligning with an alignment mark on a photomask. Preferably the alignment marks are formed on the grid line region of the wafer.

REFERENCES:
patent: 4309813 (1982-01-01), Hull
patent: 4356223 (1982-10-01), Iida et al.
patent: 4419013 (1983-12-01), Heimer

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