Alignment marks of semiconductor substrate and manufacturing met

Details Alignment marks of semiconductor substrate and manufacturing met Alignment marks of semiconductor substrate and manufacturing met

1998-07-02

2000-10-31

Smith, Matthew

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

257308, 438254, 438401, H01L 23544

Patent

active

061407119

ABSTRACT:
An alignment mark which is employed for the alignment of a semiconductor substrate during a lithography process in the production of a semiconductor element, includes a trough-like pattern having a width roughly equal to the width of a circuit element provided at the surface of the semiconductor substrate. Since the width of the trough-like pattern is set roughly equal to that of the circuit element, a secure trough-like pattern that will not be removed to an excessive degree during processes such as etch-back is formed at the surface of the semiconductor substrate, even if the alignment mark is formed concurrently with the formation of the circuit element. Consequently, a clear alignment mark that can be produced concurrently with the formation of a circuit element of the semiconductor circuit element and that presents no risk of collapsing or separating, is provided.

REFERENCES:
patent: 5523254 (1996-06-01), Satoh et al.
patent: 5811331 (1998-09-01), Ying et al.
patent: 5856220 (1999-01-01), Wang et al.
patent: 5869383 (1999-02-01), Chien et al.
patent: 5877064 (1999-03-01), Chang et al.
patent: 5889335 (1999-04-01), Kuroi et al.
patent: 5915189 (1999-06-01), Sim

Affiliated with

Also associated with

Rating

Alignment marks of semiconductor substrate and manufacturing met does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Alignment marks of semiconductor substrate and manufacturing met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alignment marks of semiconductor substrate and manufacturing met will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2055321