Alignment marks for fine-line device fabrication

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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Details

356400, G01B 1100

Patent

active

046232575

ABSTRACT:
A high-precision alignment pattern for fine-line device fabrication comprises unique marks. The pattern is utilized to align a mask or reticle with respect to a wafer and/or to evaluate actual level-to-level registration achieved between a set of masks or reticles and a wafer. One mark of the pattern comprises two spaced-apart parallel lines. The other mark comprises a notch or arrow-head including an apex portion. In practice, the orientation between the apex portion and the associated parallel lines of the pattern can be read relatively easily with high accuracy.

REFERENCES:
patent: 3990798 (1976-11-01), White
patent: 4529314 (1985-07-01), Ports

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