Alignment-mark measurements on the backside of a wafer for synch

Details Alignment-mark measurements on the backside of a wafer for synch Alignment-mark measurements on the backside of a wafer for synch

1997-07-02

1999-07-27

Hantis, K P

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

G01B 1100

Patent

active

059299975

ABSTRACT:
The present invention discloses a method for aligning a reticle with a semiconductor wafer. The method includes the steps of (a) applying a light source and an optical system for directing an incident light beam to a plurality of reticle alignment marks on the reticle to project a reticle-mark beam to an alignment detector therefrom; (b) applying the light source and the optical system for directing the incident light beam to a plurality of wafer alignment marks on a second surface of the wafer for projecting a wafer-mark beam therefrom wherein the second surface opposite a first surface of the wafer facing the reticle; and (c)applying the optical system for directing the wafer-mark beam to the alignment detector for precisely aligning the reticle and the wafer.

REFERENCES:
patent: 3865483 (1975-02-01), Wojcik
patent: 4952060 (1990-08-01), Ina et al.
patent: 5048968 (1991-09-01), Suzuki

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