Alignment mark, laser trimmer and semiconductor device manufactu

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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G01B 1100

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055283721

ABSTRACT:
In a semiconductor device fabrication process, a so-called alignment mark or position-alignment mark, a laser trimmer are used. The position-alignment mark makes a considerable difference in amount between a vertically reflected laser beam light from the position-alignment mark and that from the background thereof to strengthen a contrast between the position-alignment mark and the background surrounding the mark, so that a signal-to-noise ratio (SN ratio) is considerably improved to enable a precise position alignment to be performed in the semiconductor device fabrication process. The position-alignment mark comprises: a position-detecting target having high reflectance; and a pair of low-reflectance regions which sandwich the position-detecting target therebetween.

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