Alignment mark for electron beam lithography

Radiant energy – Means to align or position an object relative to a source or...

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2504922, G01N 2100, G01J 100

Patent

active

061181285

ABSTRACT:
An alignment mark for fabricating a semiconductor device having a high density of circuit patterns and fine patterns using electron beam lithography techniques. No electrical charging of the alignment mark occurs during several scans by the electron beam. The area of a conductive layer and the area where the surface of a semiconductor substrate is exposed are reversed from those of the conventional alignment mark. The novel alignment mark includes a surface of the semiconductor substrate exposed through a conductive layer on the semiconductor substrate.

REFERENCES:
patent: 4642672 (1987-02-01), Kitakata
patent: 4737646 (1988-04-01), King et al.
patent: 5523576 (1996-06-01), Koike et al.
patent: 5708276 (1998-01-01), Ohkawa et al.

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