Alignment mark for coarse alignment and fine alignment of a...

Details Alignment mark for coarse alignment and fine alignment of a... Alignment mark for coarse alignment and fine alignment of a...

2007-07-17

2007-07-17

Nguyen, Henry Hung (Department: 2851)

Photocopying

Projection printing and copying cameras

Focus or magnification control

C355S053000, C430S005000

Reexamination Certificate

active

10951596

ABSTRACT:
An alignment mark for the coarse alignment and fine alignment of a semiconductor wafer in an exposure tool includes a first partial structure for generating a first reflection pattern in the exposure tool for the fine alignment of the semiconductor wafer, and a second partial structure for generating a second reflection pattern in the exposure tool for the coarse alignment of the semiconductor wafer. The first partial structure has a plurality of first structure elements, which are arranged relatively parallel and in a manner lying next to one another with a predetermined distance between midpoints symmetrically around the center of an inner region. The second partial structure has a plurality of second structure elements, formed in a manner corresponding to a pattern stored in the exposure tool and being arranged in the inner region.

REFERENCES:
patent: 5966201 (1999-10-01), Shiraishi et al.
patent: 6118517 (2000-09-01), Sasaki et al.
patent: 6778275 (2004-08-01), Bowes
patent: 2002/0039828 (2002-04-01), Hahmann et al.
patent: 2003/0053058 (2003-03-01), Tanaka
patent: 2003/0054574 (2003-03-01), Tanaka et al.
patent: 09-162102 (1997-06-01), None

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