Alignment mark for aligning wafer of semiconductor device

Details Alignment mark for aligning wafer of semiconductor device Alignment mark for aligning wafer of semiconductor device

2005-03-08

2005-03-08

Bennett, G. Bradley (Department: 2859)

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

C438S401000, C438S462000

Reexamination Certificate

active

06864590

ABSTRACT:
The present invention relates to an alignment mark for use in a wafer alignment and a method for fabricating the same. The alignment mark for use in the wafer alignment includes: a first mark formed on a semiconductor layer; a second mark formed adjacent to the first mark on the semiconductor layer; and a concave part formed between the first mark and the second mark by etching a partial portion of the semiconductor layer, wherein the alignment mark is used to align a wafer by detecting a zeroth order diffract light reflected from a sloped surface formed because of a difference in height between the concave part and the first or second mark.

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