Alignment mark and defect inspection method

Details Alignment mark and defect inspection method Alignment mark and defect inspection method

2008-09-25

2010-10-19

Pham, Hoa Q (Department: 2886)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C438S016000, C430S030000

Reexamination Certificate

active

07817265

ABSTRACT:
A defect inspection method is disclosed. A first type defect inspection system is used to perform a first defect inspection by aligning to an alignment mark on a wafer as a reference point for the first defect inspection. A fabrication process is performed on the wafer thereafter, and a second defect inspection is performed by using a second type defect inspection system to align the alignment mark on the wafer as the reference point for the second defect inspection.

REFERENCES:
patent: 7728969 (2010-06-01), Saito et al.
patent: 2002/0142496 (2002-10-01), Nakasuji et al.
patent: 2003/0224262 (2003-12-01), Lof et al.
patent: 2007/0023658 (2007-02-01), Nozoe et al.
patent: 2009/0050822 (2009-02-01), Nakasuji et al.

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