Alignment in a projection exposure method

Details Alignment in a projection exposure method Alignment in a projection exposure method

1997-12-12

1999-11-09

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

430 30, G03F 900

Patent

active

059811161

ABSTRACT:
A plurality of pairs of alignment marks are formed on a reticle along a scanning direction, and, when a first wafer is to be exposed, a base line amount of an alignment sensor is measured by using a first pair of alignment marks (steps 112, 113, 115), and, when a second wafer is to be exposed, the base line amount is measured by using a second pair of alignment marks and a magnification error of the reticle in the scanning direction is determined on the basis of positional displacement amounts of the alignment marks measured regarding the first wafer and positional displacement amounts of the alignment marks measured regarding the second wafer (step 115), whereby the magnification error of the reticle in the scanning direction is measured with high accuracy, without making a measuring device complicated and reducing through-put of the exposure process.

REFERENCES:
patent: 5646413 (1997-07-01), Nishi

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