Alignment for layer formation through determination of target va

Radiation imagery chemistry: process – composition – or product th – Registration or layout process other than color proofing

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430 30, G03F 900

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active

057833419

ABSTRACT:
An aligning method for aligning a layer to be formed on a substrate with layers which have been formed on the substrate includes the steps of measuring the positions of marks formed on each of at least two layers which have been formed on the substrate, and determining the positions of the layer to be formed on the substrate based on results of the measurement of the positions of the marks. The invention also relates to a method for manufacturing devices including the steps of coating a resist on a wafer on which a plurality of layers are laminated, transferring a pattern on a mask onto the resist on the surface of the wafer, developing the resist on the wafer to form a layer of the pattern on the surface of the wafer, measuring the positions of marks formed on each of at least two layers from among the plurality of layers, and aligning the wafer with the mask based on the results of the measurement.

REFERENCES:
patent: 5142156 (1992-08-01), Ozawa et al.
patent: 5150391 (1992-09-01), Ebinuma et al.
patent: 5155523 (1992-10-01), Hara et al.
patent: 5182615 (1993-01-01), Kurosawa et al.
patent: 5468580 (1995-11-01), Tanaka

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