Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1997-05-07
2000-09-19
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 565, 118429, B23K 300, B23K 308
Patent
active
06119915&
ABSTRACT:
An alignment fixture for aligning components of a solder-wave machine during manufacturing processes of PCB assemblies and other electronic devices. In one embodiment, an alignment fixture has a calibration member that is adapted to be positioned at least in part over a solder-wave of the solder-wave machine. The calibration member may be positioned at a PCB elevation defined by the elevation at which PCB assemblies move over the solder-wave during processing. The calibration member may be an alignment bar or other device that has a solder indicator to indicate the height of the solder-wave relative to the PCB elevation. Additionally, the solder indicator may indicate the extent of deviations between the height of the solder-wave and the PCB elevation across at least a portion of the solder-wave. The alignment fixture, therefore, not only determines whether the solder-wave will sufficiently cover the back side of the PCB, but it may also determine the locations where the nozzles are misaligned and the extent of any such misalignments.
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Heinrich Samuel M.
MCMS Inc.
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