Alignment features for proximity communication

Details Alignment features for proximity communication Alignment features for proximity communication

2011-04-12

2011-04-12

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257S723000, C257S731000, C257SE23023

Reexamination Certificate

active

07923845

ABSTRACT:
Embodiments of a semiconductor die that includes proximity connectors proximate to a first surface of the semiconductor die are described. This semiconductor die is configured to communicate signals with another semiconductor die via proximity communication through one or more of the proximity connectors. Moreover, the semiconductor die includes a positive feature coupled to a second surface of the semiconductor die that facilitates mechanical alignment of the semiconductor die with the other semiconductor die. Note that a first region around the positive feature defines a first plane, and the positive feature protrudes above the first plane.

REFERENCES:
patent: 6495396 (2002-12-01), Drost
patent: 7018867 (2006-03-01), Gracias
patent: 7309924 (2007-12-01), Song et al.
patent: 2004/0157360 (2004-08-01), Gracias
patent: 2006/0022336 (2006-02-01), Franzon
patent: 2007/0075442 (2007-04-01), Krishnamoorthy
patent: 1650801 (2006-04-01), None

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