Alignment correction prior to image sampling in inspection syste

Details Alignment correction prior to image sampling in inspection syste Alignment correction prior to image sampling in inspection syste

1997-06-27

2000-10-31

Lee, Young

Television

Special applications

Manufacturing

348126, H04N 718

Patent

active

061410381

ABSTRACT:
A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.

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