Alignment correction method and semiconductor device

Details Alignment correction method and semiconductor device Alignment correction method and semiconductor device

1997-05-22

2000-07-18

Hoff, Marc S.

Data processing: measuring, calibrating, or testing

Calibration or correction system

Position measurement

702 85, 702182, 36446828, G01B 2100

Patent

active

060920319

ABSTRACT:
An alignment correction method which can obtain proper correction values and a semiconductor device fabricated through this alignment method are obtained. An alignment correction part (6a) calculates a stepper correction value which is set in a stepper (4a) in next alignment from trends of true shift amounts obtained from a plurality of types of processes. The true shift amount, which is the difference between stepper correction value set in the stepper and overlay check correction values detected by overlay checking devices, is actual shift amount upon alignment. The number of the true shift amounts obtained from the plurality of types of processes is larger than that of true shift amounts obtained from a single process. Thus, a trend of the true shift amounts is proper, whereby a correction value set in the stepper for the next alignment becomes proper.

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