Alignment apparatus and method for placing modules on a circuit

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29759, 29407, 29464, 29740, 22818021, H05K 330, B23P 1900

Patent

active

054469600

ABSTRACT:
An alignment apparatus and method that provides a pick and placement tool that picks matrix leaded modules from trays, places the modules into a self-aligning nest, picks the modules from the nest and places them on a printed circuit board. The specific location and orientation of the nest with respect to a printed circuit board is known by the pick and placement tool. Once the nest has aligned the module, the tool picks the module from the nest and places it in the appropriate location on the printed circuit board. The nest has sloped sides that angle toward that bottom and are slippery. These sides funnel the module toward the bottom of the nest and correct gross misalignment. At the bottom inside of the nest are locating features into which the leads of the module fit. Between the locating features are slip surfaces so that the module leads slide into the locating features, correcting fine misalignment. Embodiments of the nest work for matrix leaded modules, including ball grid array, column grid array, and land grid array modules.

REFERENCES:
patent: 3868764 (1975-03-01), Hartlerood
patent: 3868765 (1975-03-01), Hartlerood
patent: 3931922 (1976-01-01), Jackson et al.
patent: 4342090 (1982-07-01), Caccoma et al.
patent: 4476626 (1984-10-01), Gumbert et al.
patent: 4479298 (1984-10-01), Hug
patent: 4633584 (1987-01-01), Wright et al.
patent: 4670981 (1987-06-01), Kubota et al.
patent: 4722135 (1988-02-01), Read
patent: 4776080 (1988-10-01), Christensen
patent: 4810154 (1989-03-01), Klemmer et al.
patent: 5048178 (1991-09-01), Bindra et al.
patent: 5074036 (1991-12-01), Dunaway et al.
patent: 5128834 (1992-07-01), Kaschke
patent: 5153983 (1992-10-01), Oyama
patent: 5208976 (1993-05-01), Bess et al.
Research Disclosure, BT890-0064, F. Weindelmayer, "SXLAT Chuck Pallet Lock", Oct. 1991, No. 330.
IBM Technical Disclosure Bulletin, vol. 36, No. 07, Jul. 1993, RO892-0855, "Solder Ball Connect Placement Nest", D. P. Best, et al.
Panasonic, Panasert Series, General Catalog for Internepcon, "MPA-80/40(N), Multi-Functional Placement Machine Capable of Handling . . . ," p. 17.
Surface Mount Technlogy, Nov. 1993, "CBGA: A Packaging Advantage", J. Bartley, et al, pp. 35, 36 and 40.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Alignment apparatus and method for placing modules on a circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Alignment apparatus and method for placing modules on a circuit , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alignment apparatus and method for placing modules on a circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-466205

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.