Alignment apparatus

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

Reexamination Certificate

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Reexamination Certificate

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10689525

ABSTRACT:
An alignment apparatus10comprises a table11which is provided rotatably in a plane, and equipped with a loading plane12A capable of sucking a wafer W, a shift mechanism30that moves the table11in the X- and Y-axis directions, and a sensor50that detects the position of the peripheral edge of the wafer W. The loading plane12A is provided so as to come to a position inside the periphery of the wafer W. On the other hand, outside the table11, a receiving member15, which is positioned on the generally same plane as the loading plane12A, is provided, and the receiving member15is provided with a plane configuration larger than the wafer W.

REFERENCES:
patent: 5194743 (1993-03-01), Aoyama et al.
patent: 5289263 (1994-02-01), Kiyokawa et al.
patent: 5361121 (1994-11-01), Hattori et al.
patent: 5438209 (1995-08-01), Yamamoto et al.
patent: 5648854 (1997-07-01), McCoy et al.
patent: 6124215 (2000-09-01), Zheng
patent: 6187093 (2001-02-01), Zheng
patent: 6519036 (2003-02-01), Hickman
patent: 6710886 (2004-03-01), Park et al.
patent: 6825915 (2004-11-01), Yamauchi et al.
patent: 2002/0101596 (2002-08-01), Park et al.
patent: 1194456 (1998-09-01), None
patent: 1 320 121 (2003-06-01), None
patent: 1 321 968 (2003-06-01), None
patent: 57-198642 (1982-12-01), None
patent: 60-146674 (1985-08-01), None
patent: 11160031 (1999-06-01), None
patent: 2002-148019 (2002-05-01), None
patent: 2002-148019 (2002-05-01), None
patent: 2002-329769 (2002-11-01), None
Hee-Sub Lee et al. “A 12-inch wafer prealigner”, Microprocessors and Microsystems (Elsevier Science B. V.), vol. 27 (2003), pp. 151-158.
Austrian Patent Office Search Report dated May 12, 2004.
Office Action dated Apr. 7, 2006 issued in corresponding Chinese Application No. 200310104349.1.

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