Aligning method

Details Aligning method Aligning method

1995-03-08

1996-07-02

Rosasco, S.

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

430 5, 355 53, 355 57, 356399, 356401, G03F 900

Patent

active

055320910

ABSTRACT:
Three layer patterns are formed on a shot area, and wafer marks for X axis and wafer marks for Y axis are formed in each of the first to third layers. When a reticle pattern to be exposed has a certain relationship with the first and second layer patterns, an alignment reference coordinate value is determined on the basis of coordinate values of the wafer marks in the first and second layers. Alignment between a predetermined shot area and a reticle pattern is performed on the basis of the alignment reference coordinate value. The alignment reference coordinate value can be determined on the basis of an average value or a weighted mean value of the coordinate values of the wafer marks.

REFERENCES:
patent: 5005046 (1991-04-01), Hashimoto
patent: 5262822 (1993-11-01), Kosugi et al.

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