Aligner, wafer transferring device, and semiconductor...

Material or article handling – Article reorienting device – Orienter has article gripping means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C414S936000

Reexamination Certificate

active

07959400

ABSTRACT:
In a preferred embodiment, an aligner includes a grip mechanism provided with a plurality of damp arms for holding an external periphery of a wafer; a rotary mechanism for rotating the grip mechanism to rotate the wafer in a prescribed rotational direction, and a lifter mechanism provided with a plurality of lift arms for lifting up the wafer above the grip mechanism. The aligner is configured to align the wafer by the grip operation of the grip mechanism and the rotary operation of the rotary mechanism, and one or more of the plurality of the lift arms which interfere with one or more of the plurality of clamp arms at the time of lifting up the plurality of lift arms are engaged with restriction members provided on the grip mechanism to prevent an upward movement thereof.

REFERENCES:
patent: 4770600 (1988-09-01), Ishikawa
patent: 4788994 (1988-12-01), Shinbara
patent: 5100502 (1992-03-01), Murdoch et al.
patent: 5566466 (1996-10-01), Hearne
patent: 5851041 (1998-12-01), Anderson et al.
patent: 5990650 (1999-11-01), Brock
patent: 7789614 (2010-09-01), Yoshino et al.
patent: 2004/0060195 (2004-04-01), Garcia et al.
patent: 2006/0245846 (2006-11-01), Moura et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Aligner, wafer transferring device, and semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Aligner, wafer transferring device, and semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Aligner, wafer transferring device, and semiconductor... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2737332

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.