Aligner bonder

Details Aligner bonder Aligner bonder

1988-10-28

1990-02-13

Ramsey, Kenneth J.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228 62, 2281802, 358101, H01L 2168, H01L 2158

Patent

active

048999210

ABSTRACT:
An aligner bonder for joining parts of a miniature semiconductor component, for example, comprises supports for holding the parts with surfaces facing, positioning provisions for adjusting relative positions and inclinations of the parts and for bringing the facing surfaces together for bonding. A first inclined two-sided mirror directs light from a pair of illuminators to the surfaces. Images of the surfaces are diverted from the inclined reflective mirror faces to optical paths and then to video cameras. Individual video circuitry and illuminator adjustments permit adjustment of each video image. The images are combined in a single video image displayed on a monitor. The supports for the parts are positionally adjusted to bring the video images into alignment. To adjust parallelism, autocollimators and associated reference image cross hairs project reference images via another inclined two-sided mirror to the surfaces of the parts or parallel reference surfaces. The reference image projected to the surfaces are reflected back to the video cameras via the reflective faces of the second two-sided mirror and associated optical paths. The positional relationship of the two reference images, as they appear in a combined video display are indicative of the relative inclination of the surfaces and can be adjusted to bring the surfaces parallel before retracting the probe from between the surfaces, bringing together the surfaces and bonding the parts.

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Arndt, H. L., IBM Technical Disclosure Bulletin entitled "Optical Alignment Apparatus for Microelectronics Packaging", Jan. 1968, pp. 1250-1251, vol. 10, No. 8.

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